We will be showcasing advanced SoC designs and solutions during DesignCon 2019 at the Santa Clara Convention Center in Santa Clara, CA on Jan. 29 – Jan. 31.
Don’t miss us at the show. Schedule a private meeting and demo with our team of experts – and be sure to visit our Booth #1234 for a chance to win one of the great prizes we will giving away at the show.
Highlights of Socionext Demos at DesignCon
Demos will include 56G-PAM4 SerDes, utilizing our ultra-high-speed ADC & DAC technology, and high-end packaging solutions. Here’s a peek at what we have planned:
- Signal Integrity for High-Performance Systems - We will showcase our high-performance, energy-efficient edge server with AI accelerator delivering powerful parallel processing performance for video processing and image recognition. This video management system is optimized for facial and object recognition ideal for surveillance and security applications.
- Low-Power, High-Performance 56/112G SerDes - Our 112G SerDes technology demo will highlight how cloud service providers can accommodate ever-growing data center traffic with our high-speed signaling solutions for chip-to-module, chip-to-chip, and board-to-board communications.
- High Speed ADC/DAC for Communications and Networking - Socionext will demonstrate solutions of ultra-energy-efficient 56Gb/s PAM4 SR to LR CMOS transceivers optimized to help companies cost-effectively meet the ever-increasing demand for performance, functionality and design requirements.
- Cost-Saving Multi-Die Packaging Solutions - We will also demo our advanced “Chip-Package-PCB co-design” methodology developed to help companies quickly and cost-effectively deliver high-quality, high-performance, multi-die packaging and RF/mmWave solutions.
Other product categories include:
- Design Tools
- Electronic Components
- Hardware Design Tools
- Hardware IP/Cores
- System Boards/PCBs
Meet Us at DesignCon 2019
Submit the form below to meet with our team of experts at the show.