Key Features
- Equipped with outer leads at the four corners of the package.
- Superior cost performance with a mature technology.
- High reliability in mounting the package on printed circuit boards.
- TEQFP and HQFP can be mounted with a chip with high heat emission because of its high efficiency in heat dissipation.
QFP Package External View
LQFP
TEQFP
QFP and LQFP Package Cross Section
TEQFP Package Cross Section
QFP Packages Lineup
| Package type | Package size (mm) | Mounting height (mm) | Pin count | |||
|---|---|---|---|---|---|---|
| X | Y | Pin pitch 0.65mm | Pin pitch 0.50mm | Pin pitch 0.40mm | ||
| QFP | 14.0 | 20.0 | 3.35 Max. | 100 | - | - |
| 28.0 | 28.0 | 3.95 Max. | - | 208 | - | |
| 4.03 Max. | - | - | 256 | |||
| 32.0 | 32.0 | - | 240 | - | ||
| LQFP TEQFP |
7.0 | 7.0 | 1.70 Max. | - | 48 | 64 |
| 10.0 | 10.0 | 52 | 64 | - | ||
| 12.0 | 12.0 | 64 | 80 | - | ||
| 14.0 | 14.0 | - | 100 | - | ||
| 16.0 | 16.0 | - | 120 | 144 | ||
| 20.0 | 20.0 | - | 144 | - | ||
| 24.0 | 24.0 | - | 176 | 216 | ||
| 28.0 | 28.0 | - | 208 | 256 | ||
| HQFP | 28.0 | 28.0 | 3.95 Max. | - | 208 | - |
| 4.03 Max. | - | - | 256 | |||
| 32.0 | 32.0 | - | 240 | 296 | ||
| 40.0 | 40.0 | 4.10 Max. | - | 304 | - | |
Please contact us for information on other packages.
