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Home > Products > Advanced Packaging > QFP/LQFP/TEQFP/HQFP

QFP/LQFP/TEQFP/HQFP

October 25, 2015

Key Features

  • Equipped with outer leads at the four corners of the package.
  • Superior cost performance with a mature technology.
  • High reliability in mounting the package on printed circuit boards.
  • TEQFP and HQFP can be mounted with a chip with high heat emission because of its high efficiency in heat dissipation.

QFP Package External View

LQFP
LQFP

TEQFP
TEQFP

QFP and LQFP Package Cross Section
QFP and LQFP Package Cross Section

TEQFP Package Cross Section
TEQFP Package Cross Section

QFP Packages Lineup

Package type Package size (mm) Mounting height (mm) Pin count
X Y Pin pitch 0.65mm Pin pitch 0.50mm Pin pitch 0.40mm
QFP 14.0 20.0 3.35 Max. 100 - -
28.0 28.0 3.95 Max. - 208 -
4.03 Max. - - 256
32.0 32.0 - 240 -
LQFP
TEQFP
7.0 7.0 1.70 Max. - 48 64
10.0 10.0 52 64 -
12.0 12.0 64 80 -
14.0 14.0 - 100 -
16.0 16.0 - 120 144
20.0 20.0 - 144 -
24.0 24.0 - 176 216
28.0 28.0 - 208 256
HQFP 28.0 28.0 3.95 Max. - 208 -
4.03 Max. - - 256
32.0 32.0 - 240 296
40.0 40.0 4.10 Max. - 304 -

Please contact us for information on other packages.

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