We appreciated the opportunity to meet with you at DesignCon this year. Our team had a great time showing off our advanced packaging solutions and high-performance SoC designs.
Let’s keep the conversation going. Set up a time to talk with someone on our team by filling out our form below. Or contact us to receive product evaluation and purchase information.
You can also learn more about the products we demoed at the show below.
Thanks again for taking the time to come by the Socionext booth at DesignCon!
Socionext Demos @ DesignCon
Signal Integrity for High-Performance Systems
We showcased our high-performance, energy-efficient edge server with an AI accelerator that delivers powerful parallel processing performance for video processing and image recognition. This video management system is optimized for facial and object recognition and is ideal for surveillance and security applications.
Cost-Saving Multi-Die Packaging Solutions
We also demonstrated our advanced “Chip-Package-PCB co-design” methodology developed to help companies quickly and cost-effectively deliver high-quality, high-performance, multi-die packaging and RF/mmWave solutions.
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