We appreciated the opportunity to meet with you at DesignCon this year. Our team had a great time showing off our advanced packaging solutions and high-performance SoC designs. You can learn more about the products we demoed at the show below.
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Thanks again for taking the time to come by the Socionext booth at DesignCon!
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Socionext Demos at DesignCon 2020
AI computer vision demo featuring high-performance signal integrity
We demonstrated a computer vision system powered by the Socionext's scalable, ARM®-based multi-core processor. The system enables real-time video processing and analysis while providing an easy-to-use interface for managing multiple IP video streams.
We showcased our range of high-performance, multi-die package methodology and designs. Offerings included our FanOut Wafer Level Packaging (FOWLP), RF/mmWave solutions, multi-die chiplets supporting a wide range of process nodes, interconnects and die-to-die (D2D) interfaces.
Next-generation host interface PCIe Gen5
Socionext offers PCIe Gen5 technology for bridging the IO gap between server CPUs and the host bus adapters that create the 400G network. Find out how we can help you stay ahead of the curve with the emergence of 5G.
Data center 112Gbps+ SerDes
We also demonstrated our high-performance SerDes macro with up to 112Gbps per channel for 400G networks. Visitors were able to see how ultra-high-speed ADC/DAC technologies play a key role in coherent and direct detect optical networking SoCs, enabling terabit (Tbps) data center interconnect (DCI) solutions for hyper-scale cloud operators.
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