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Home > Products > Advanced Packaging > FBGA

FBGA

October 25, 2015

Key Features

  • Low profile and multi-pin support, suitable for portable devices such as mobile phones and DSCs.
  • Fine pitch (pin pitch from 0.4mm) and thin.
  • Superior electrical characteristics and reliability.
  • Plentiful line-up and customization support.

FBGA Package External View

FBGA Package External

FBGA Package Cross Section

FBGA Package Cross Section

CSP Roadmap

CSP Roadap

Because of our extensive implementation technologies, we are able to give our customers the most suitable SiP to meet their needs.

Please do not hesitate to contact us.

Module Package Road Map

Module Package Road Map

FBGA Package Lineup

Pin pitch : 0.5mm (Less than 500pin)

Package code Pin count Package size (mm) Pin arrangement
Total number of TBs* included X Y
BGA-66P-M01 66 9 5.0 5.0 2 rows
BGA-82P-M01 82 9 6.0 6.0 2 rows
BGA-96P-M04 96 0 6.0 6.0 3 rows
BGA-100P-M03 100 0 7.0 7.0 2 + (1) + 1 rows
BGA-112P-M05 112 0 7.0 7.0 3 rows
(With nonexistent pins)
BGA-130P-M02 130 9 7.0 7.0 3 rows
BGA-144P-M09 144 0 7.0 7.0 4 rows
BGA-168P-M03 168 25 9.0 9.0 3 rows
(With nonexistent pins)
BGA-208P-M01 208 0 9.0 9.0 4 rows
BGA-232P-M01 232 0 12.0 12.0 2 + (1) + 2 rows
BGA-240P-M02 289 49 10.0 10.0 4 rows
BGA-240P-M03 240 0 10.0 10.0 4 rows
BGA-289P-M01 289 25 10.0 10.0 3 + (1) + 2 rows
BGA-304P-M05 304 0 13.0 13.0 2 + (1) + 2 rows
BGA-304P-M07 304 0 12.0 12.0 4 rows
BGA-337P-M02 428 81 13.0 13.0 4 rows
BGA-345P-Mxx 345 25 12.0 12.0 2 + (1) + 2 + (1) + 1 rows
BGA-385P-M01 434 49 13.0 13.0 3 + (1) + 2 rows
BGA-385P-M02 385 81 13.0 13.0 2 + (2) + 2 rows
BGA-385P-M03 385 81 12.0 12.0 4 rows
BGA-400P-M04 481 81 15.0 15.0 4 rows

*TB : Thermal Ball

Pin pitch : 0.5mm (500pin or more)

Package code Pin count Package size (mm) Pin arrangement
Total number of TBs* included X Y
BGA-506P-Mxx 506 81 14.0 14.0 3 + (1) + 2 rows
BGA-562P-M03 562 81 14.0 14.0 3 + (1) + 3 rows
BGA-586P-Mxx 586 121 15.0 15.0 3 + (1) + 2 rows
BGA-586P-M04 586 49 15.0 15.0 4 + (1) + 2 rows
BGA-610P-M01 610 121 16.0 16.0 3 + (2) + 2 rows
BGA-650P-M03 650 169 15.0 15.0 5 rows
BGA-753P-Mxx 753 169 18.0 18.0 3 + (1) + 2 rows
BGA-770P-M01 770 121 16.0 16.0 4 + (1) + 3 rows
BGA-842P-Mxx 842 169 18.0 18.0 3 + (1) + 2 rows
BGA-906P-Mxx 906 169 18.0 18.0 3 + (1) + 2 + (1) + 2 rows

*TB : Thermal Ball

Pin pitch : 0.65mm

Package code Pin count Package size (mm) Pin arrangement
Total number of TBs* included X Y
BGA-176P-M05 176 0 11.0 11.0 4 rows
BGA-204P-M01 204 0 11.0 11.0 3 + (1) + 2 rows
BGA-240P-M07 240 0 13.0 13.0 4 rows
BGA-252P-M01 252 0 13.0 13.0 5 rows
(With nonexistent pins)
BGA-280P-M03 280 0 13.0 13.0 5 rows
BGA-360P-M05 441 81 16.0 16.0 5 rows
BGA-385P-M04 385 25 16.0 16.0 5 rows

*TB : Thermal Ball

Pin pitch : 0.80mm

Package code Pin count Package size (mm) Pin arrangement
Total number of TBs* included X Y
BGA-112P-M04 112 0 10.0 10.0 4 rows
BGA-144P-M06 144 0 12.0 12.0 4 rows
BGA-144P-M07 144 0 12.0 12.0 4 rows
(With nonexistent pins)
BGA-176P-M04 176 0 12.0 12.0 5 rows
(With nonexistent pins)
BGA-188P-M01 188 0 15.0 15.0 4 rows
(With nonexistent pins)
BGA-192P-M06 192 - 12.0 12.0 Full Matrix
(With nonexistent pins)
BGA-224P-M06 224 0 16.0 16.0 4 rows
BGA-224P-M08 260 36 16.0 16.0 4 rows
BGA-224P-M09 288 64 16.0 16.0 4 rows
BGA-240P-M06 240 0 15.0 15.0 5 rows
BGA-256P-M17 256 49 18.0 18.0 2 + (1) + 2 rows
BGA-272P-M06 321 49 18.0 18.0 4 rows
BGA-272P-M08 272 0 18.0 18.0 4 rows
BGA-320P-M05 369 49 18.0 18.0 5 rows
BGA-441P-M01 441 - 18.0 18.0 Full Matrix

*TB : Thermal Ball

Please contact us for information on other pin arrangements.

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