We appreciated the opportunity to meet with you at DesignCon this year. Our team had a great time showing off our advanced packaging solutions and high-performance SoC designs.
We'd love to keep the conversation going. Set-up a time to talk with someone on our team by filling out our form below. Or contact us for product evaluation and purchase information.
You can also learn more about the products we demoed at the show:
Learn more about our demos from DesignCon.
Low-power, high-performance SerDes to 112G – Our ultra-energy-efficient 56Gb/s PAM4 SR to LR CMOS transceivers are optimized to help companies cost-effectively meet today’s performance, functionality and time-to-market package design requirements.
ADC/DAC For Terabit+ Optical Communications – We offer ultra-high-speed ADC and DAC technology for coherent and direct detect optical networking SoCs. This enables Terabit (Tbps) datacenter interconnect (DCI) solutions for hyperscale cloud operators.
Cost-Saving Multi-Die Packaging – As a leading provider of extended HBM+, multi-die packaging, and advanced process node solutions, our high-quality designs meet the increasing demand for greater interconnect bandwidth, larger on-chip memory, and ultra-low latency.
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