DesignCon serves the high-speed communications and semiconductor communities offering state-of-the-art design methodologies, applications, technologies, and unparalleled networking opportunities. For more information, visit the event web site.
At this year's DesignCon, Socionext will showcase advanced SoC designs and solutions, including our Datacenter 112Gbps+ SerDes utilizing the company’s ultra-high speed ADC & DAC technology, and high-end packaging solutions aswell as our next generation host interface PCIe Gen5 solution.
This year, there are several opportunities to hear about Socionext and our products:
• Thursday, Jan 30th at 3PM Ansys Booth 745 – Dan Lambalot will present "Modelling and measurement correlation for a 112Gbps package + PCB using HFSS and SIWave with HFSS regions"
• Thursday, Jan 30th at 4:30pm Ansys Booth 745 - Takafumi Shimada, Electromagnetic Analysis Specialist at SNI, will present "Automating the Multi-Physics Simulation Process for LSI-Package-Board"
Click here for more information.
Visit Socionext's booth (#1234)
Meet us at event
Meet with one of our product experts at the show. Contact us to make an appointment.