Event Overivew
DesignCon serves the high speed communications and semiconductor communities offering state-of-the-art design methodologies, applications, technologies, and unparalleled networking opportunities. For more information, visit the event web site.
At this year's Designcon., Socionext, at booth 1239, will showcase advanced SoC design and solutions including ultra energy-efficient 56Gb/s CMOS transceivers, 100+Gbps transceiver utilizing the company’s ultra-high speed ADC & DAC technology, and high-end packaging solutions. On February 2 at 4PM, Socionext and partners will jointly deliver a technical presentation on advanced I/O interface design.
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Event Details
Date
February 1 - 2, 2017
Location
Booth 1239
Santa Clara Convention Center, Santa Clara, CA
Socionext Presentation
Track 7, Feb. 2, 2017 at 4PM - “Advanced IO Interface Design for Memory and 2.5D/3D/SiP Integrations”
