Key Features Wafer process and bumping in consolidated assembly. Technology supporting wide range of products from low-end applications such as mobile devices and digital electric household appliances to high-end applications such as servers. Promote multi-pin with min. 50µm AL pad pitch. Able to form wiring layer under a bump on demand. Bump external view Manufacturing Read More
WL-CSP
Key Features Ultra-compact, ultra-thin, multi-pin, and superior humidity and reflow resistance by wafer consistent assembly. Ultra-compact, ultra-thin, and light-weight suitable for mobile devices and digital electric household appliances. JEDEC Moisture Sensitivity Level 1 clear. Support for pin pitch at less than or equal to 0.5mm contributing towards multi-pin. High-speed transmission by reducing the wire length. Read More
FC-BGA
Key Features Superior electrical and thermal performance thanks to the flip chip bonding technology. Wide support from consumer appliances to high-end applications including servers. Support for ultra multi-pin by arranging the chip electrode over an area. Good dissipation of heat produced from the high electric consumption chip by deployment of a heat spreader. Capable of Read More
TEBGA
Key Features Superior thermal characteristics. Superior support for multi-pin. Package sizes at 27mmSQ and 35mmSQ are available. TEBGA Package external view TEBGA Package Cross Section TEBGA Package line-up Package code Pin count Package size (mm) Pin arrangement Pin pitch (mm) Total number of TBs* included X Y BGA-320P-Mxx 320 64 27.0 27.0 4 rows 1.27 Read More
PBGA
Key Features Sealed with plastic resin to achieve high cost performance. Superior support for multi-pin. Package sizes at 27mmSQ, 31mmSQ, and 35mmSQ are available. PBGA Package External View PBGA Package Cross Section PBGA Package line-up Package code Pin count Package size (mm) Pin arrangement Pin pitch (mm) Total number of TBs* included X Y BGA-256P-M24 Read More