Key Features Low profile and multi-pin support, suitable for portable devices such as mobile phones and DSCs. Fine pitch (pin pitch from 0.4mm) and thin. Superior electrical characteristics and reliability. Plentiful line-up and customization support. FBGA Package External View FBGA Package Cross Section CSP Roadmap Because of our extensive implementation technologies, we are able to Read More
SON/QFN
Key Features SON/QFN: Thin and compact. Better cost performance compared to BGA SON/QFN Package external view SON QFN SON and QFN Package cross section SON Package line-up Package size (mm) Mounting height (mm) Pin count X Y Pin pitch 0.65mm Pin pitch 0.50mm Pin pitch 0.40mm 2.5 3.5 0.80 Max. – – 24 3.0 3.0 Read More
QFP/LQFP/TEQFP/HQFP
Key Features Equipped with outer leads at the four corners of the package. Superior cost performance with a mature technology. High reliability in mounting the package on printed circuit boards. TEQFP and HQFP can be mounted with a chip with high heat emission because of its high efficiency in heat dissipation. QFP Package External View Read More
SOP/TSSOP
Key Features Superior cost performance with a mature technology. High reliability in mounting the package on printed circuit boards. Thin and compact. SOP/TSSOP Package external view SOP TSSOP SOP and TSSOP Package cross section SON Package line-up Package type Package size (mm) Mounting height (mm) Pin count X Y Pin pitch 1.27mm Pin pitch 0.65mm Read More
Advanced Packaging
Advanced Packaging Solutions for High-performance Products Socionext is the market leader in high-performance packages. With in-house expertise in high-pin-count, flip-chip and multi-chip-module packaging technology, we offer customers differentiated package solutions. Our thermally efficient package designs are capable of high-speed signaling over a 30GHz bandwidth. Specifically, our packages feature high ball counts with more than 4,000 Read More