Featuring High Performance SoC, Ultra-High-Speed CMOS Transceivers with 112G+ SerDes, Multi-Die Packaging, and extended HBM+
SUNNYVALE, Calif., January 18, 2017 – Socionext Inc., a leader in state-of-the art system-on-chip technology, will feature its high performance SoC designs, serial transceiver technologies and advanced packaging solutions at the annual DesignCon conference, Jan. 31 – Feb. 1 at the Santa Clara Convention Center, Booth 1239.
At DesignCon, Socionext will showcase ultra-energy-efficient 56Gb/s PAM4 SR to LR CMOS transceivers and demonstrate solutions that are optimized to help companies cost-effectively meet today’s performance, functionality and time-to-market package design requirements.
As Cloud Service Providers adopt 56Gb/s serial connectivity to accommodate the rapid growth of traffic in their data centers, they require 56+Gb/s signaling for chip-to-module, chip-to-chip, and board-to-board communications. Socionext offers proven energy-saving SerDes transceivers operating from 1 to 56Gb/s, with 112+ Gb/s solutions available later in 2018.
Socionext’s roadmap further extends these capabilities by utilizing its ultra-high-speed ADC & DAC technologies, a key component in coherent and direct detect optical networking SoCs enabling Terabit (Tbps) datacenter interconnect (DCI) solutions for hyperscale cloud operators.
Furthermore, with the adoption of Artificial Intelligence applications within the cloud data center, there is an increasing demand for greater interconnect bandwidth, larger on-chip memory, and ultra-low latency. Socionext is a leading provider of extended HBM+, multi-die packaging, and advanced process node solutions for meeting and exceeding these emerging requirements. As a proven and reliable partner, Socionext quickly delivers high-quality designs that use advanced packaging, high-performance, multi-die SoCs.
Socionext will be raffling great prizes at DesignCon, so stop by booth#1239 to learn more!
For the DesignCon website and programs, visit http://www.designcon.com/
About Socionext America Inc.
Socionext America Inc. (SNA) serves as the US arm of Socionext Inc., a global leading fabless semiconductor supplier specializing in SoCs. Headquartered in Milpitas, California, SNA delivers cutting-edge technologies and a diverse array of customizable solutions. The company meets customer demands by providing high-quality semiconductor products, leveraging proven design methodologies and state-of-the-art implementation expertise. Additionally, SNA collaborates closely with industry-leading partners across manufacturing, IP, EDA, and software.
For product information, visit our website, e-mail [email protected] or call 1-844-868-1795. For company news and updates, connect with us on LinkedIn, YouTube, Facebook and X.
About Socionext Inc.
Socionext Inc., a leading global System-on-Chip (SoC) supplier, is a pioneer of the ‘Solution SoC’ business model. This innovative approach encompasses Socionext’s ‘Entire Design’ capabilities and offering of ‘Complete Service’. As a trusted silicon partner, Socionext fuels global innovation, providing superior features, performance, and quality that set its customers’ products and services apart in diverse domains ranging from automotive and data centers to networking, smart devices, and industrial equipment.
Socionext Inc., based in Yokohama, operates offices across Japan, Asia, the United States, and Europe for development and sales. For more information, visit https://www.socionext.com/en/.
All company or product names mentioned herein are trademarks or registered trademarks of their respective owners. Information provided in this press release is accurate at time of publication and is subject to change without advance notice.
Press Contacts
Sherry Chen
Socionext America Inc.
1-408-737-5654
[email protected]
Dick Davies
IPRA
1-415-652-7515
[email protected]
