Key Features
- Ultra-compact, ultra-thin, multi-pin, and superior humidity and reflow resistance by wafer consistent assembly.
- Ultra-compact, ultra-thin, and light-weight suitable for mobile devices and digital electric household appliances.
- JEDEC Moisture Sensitivity Level 1 clear.
- Support for pin pitch at less than or equal to 0.5mm contributing towards multi-pin.
- High-speed transmission by reducing the wire length.
- Compliant with JEITA standards and fully customizable according to customer needs.
WL-CSP External view
Processes
Package cross section
WL-CSP Technology Road map
2010 | 2011 | 2012 | ||
---|---|---|---|---|
WL-CSP Structure |
Height(Min) | 0.25 mm | ← | ← |
Ball/Land pitch(Min) | 0.30 mm | ← | 0.25 mm | |
Ball/Land dia.(Min) | 0.15 mm | ← | 0.13 mm | |
RDL Technology |
Line/Space | 20µm/15µm | ← | 15µm/15µm |
Via/Land Pitch(Inline) | 50µm | ← | 40µm | |
Others | Wafer size | 6/8/12inch | ← | ← |
Scribe Width (Min) 6/8 in 12 in |
90µm | ← | ← | |
90µm (<=0.35-t) | ← | ← | ||
100µm (>0.35-t) | ← | ← | ||
Solder | Pb Free | ← | ← | |
Mold resin | Halogen Free | ← | ← |
WL-CSP Mass-production actual performance
WL-CSP | WLP112 | WLP309 | WLP15 | WLP42 | WLP70-02 | WLP143 |
---|---|---|---|---|---|---|
Wafer Size | 200 mm | 200 mm | 200 mm | 300 mm | 300 mm | 300 mm |
Package Size | 6.46 × 6.46 mm | 7.56 × 7.56 mm | 1.77 × 1.77 mm | 3.30 × 2.95 mm | 3.408 × 4.486 mm | 7.81 × 6.10 mm |
Package Height | 0.6mm Max | 0.8mm Max | 0.64mm Max | 0.50mm Max | 0.35mm Max | 0.55mm Max |
Chip Thickness | 390µm TYP | 520µm TYP | 390µm TYP | 300µm TYP | 220µm TYP | 350µm TYP |
Encapsulant Thickness |
50µm TYP | 50µm TYP | 50µm TYP | 50µm TYP | 50µm TYP | 50µm TYP |
Ball Pitch | 0.5 mm | 0.4 mm | 0.4 mm | 0.4 mm | 0.4 mm | 0.5 mm |
Ball Height | 110µm TYP | 150µm TYP | 150µm TYP | 100µm TYP | 100µm TYP | 100µm TYP |